Sipesifikesonu
PCB Technical Agbara
Ṣiṣejade Mass Layers: 2 ~ 58 Layer / Pilot run: 64 layers
O pọju. Sisanra Ibi gbóògì: 394mil (10mm) / Pilot run: 17.5mm
Awọn ohun elo FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Awọn ohun elo apejọ ọfẹ ọfẹ) Halogen-ọfẹ, Seramiki kun, Teflon, Polyimide, BT, PPO, PPE, Arabara, Apakan arabara, bbl
Min. Iwọn/Alafo Layer Inu: 3mil/3mil (HOZ), Layer ita: 4mil/4mil(1OZ)
O pọju. Ejò Sisanra 6.0 iwon / Pilot run: 12OZ
Min. Iwon Iho Mechanical lu: 8mil (0.2mm) lesa lu: 3mil (0.075mm)
Ipari Dada HASL,Gold Immersion, Tin Immersion, OSP, ENIG + OSP, Immersion, ENEPIG, Ika goolu
Ilana pataki ti a sin iho, iho afọju, Resistance ti a fi sinu, Agbara ti a fi sinu, arabara, arabara apakan, iwuwo giga apakan, liluho pada, ati iṣakoso Resistance
PCBA imọ Agbara
Awọn anfani ---- Iṣagbesori dada Ọjọgbọn ati imọ-ẹrọ titaja nipasẹ iho
---- Awọn titobi oriṣiriṣi bii 1206,0805,0603 awọn paati SMT imọ-ẹrọ
----ICT (Ninu Idanwo Circuit),FCT (Ayẹwo Circuit Iṣẹ)
---- Apejọ PCB Pẹlu UL, CE, FCC, Ifọwọsi Rohs
---- Imọ-ẹrọ titaja isọdọtun gaasi Nitrogen fun SMT.
---- High Standard SMT&Solder Apejọ Laini
---- Iwọn iwuwo giga ti o ni asopọ pẹlu agbara imọ-ẹrọ gbigbe igbimọ.
Awọn ohun elo Palolo Isalẹ si iwọn 0201, BGA ati VFBGA, Awọn Ti ngbe Chip Alailẹgbẹ/CSP
Apejọ SMT-meji, Pitch Fine si 0.8mils, Atunṣe BGA ati Bọọlu
Idanwo Idanwo Flying Probe, Ayẹwo X-ray AOI
SMT Ipo išedede | 20 um |
Iwọn irinše | 0.4×0.2mm(01005) —130×79mm, Flip-CHIP, QFP, BGA, POP |
O pọju. paati iga | 25mm |
O pọju. PCB iwọn | 680× 500mm |
Min. PCB iwọn | ko si opin |
PCB sisanra | 0.3 si 6mm |
Igbi-Solder Max. PCB iwọn | 450mm |
Min. PCB iwọn | ko si opin |
Giga paati | Top 120mm / Bot 15mm |
Lagun-Solder Irin iru | apakan, odidi, inlay, sidetep |
Ohun elo irin | Ejò, Aluminiomu |
Dada Ipari | plating Au, , fifi Sn |
Oṣuwọn àpòòtọ afẹfẹ | kere ju 20% |
Tẹ-fit Tẹ ibiti | 0-50KN |
O pọju. PCB iwọn | 800X600mm |