Bọtini pcb bọtini ti a lo lori Ẹrọ Iṣoogun pẹlu apejọ BGA pẹlu ISO 13485
Lati igbimọ olona-Layer pupọ si apẹrẹ oke apa meji, ibi-afẹde wa ni lati fun ọ ni ọja didara kan ti o pade awọn ibeere rẹ ati pe o jẹ idiyele-doko julọ lati ṣe iṣelọpọ
Iriri wa ni awọn ipele IPC kilasi III, awọn ibeere mimọ lile pupọ, bàbà eru ati awọn ifarada iṣelọpọ gba wa laaye lati pese awọn alabara wa ni deede ohun ti wọn nilo fun ọja ipari wọn.
Awọn ọja imọ-ẹrọ to ti ni ilọsiwaju:
Awọn ọkọ ofurufu ẹhin, awọn igbimọ HDI, awọn igbimọ igbohunsafẹfẹ giga-giga, awọn igbimọ TG giga, awọn igbimọ ti ko ni halogen, awọn igbimọ rọ ati rigidi-flex, awọn arabara ati awọn igbimọ eyikeyi pẹlu awọn ohun elo ni awọn ọja imọ-ẹrọ giga.
20-Layer PCB, 2 mil ila fifẹ aye:
Iriri iṣelọpọ ọdun mẹwa 10 wa, ohun elo pipe-giga ati awọn ohun elo idanwo jẹ ki VIT ṣe agbejade awọn igbimọ lile 20-Layer ati awọn iyika rigid-flex to awọn fẹlẹfẹlẹ 12
Awọn sisanra ti afẹyinti to .276 (7mm), awọn ipin abala ti o to 20: 1, 2/2 laini / aaye ati awọn apẹrẹ iṣakoso impedance ti wa ni iṣelọpọ lojoojumọ
Awọn ọja ati ohun elo imọ-ẹrọ:
Kan si awọn ibaraẹnisọrọ, afẹfẹ, aabo, IT, ohun elo iṣoogun, ohun elo idanwo deede ati awọn ile-iṣẹ iṣakoso ile-iṣẹ
Awọn ibeere boṣewa fun ṣiṣe awọn PCBs:ayewo ati awọn igbelewọn idanwo yoo da lori IPC-A-600 ati IPC-6012, kilasi 2 ayafi bibẹẹkọ pato lori awọn iyaworan alabara tabi awọn pato
PCB oniru iṣẹ:VIT tun le pese iṣẹ apẹrẹ PCB si awọn alabara wa
Nigba miiran, awọn alabara wa nikan fun wa ni faili 2D tabi imọran kan, lẹhinna a yoo ṣe apẹrẹ PCB, akọkọ ati ṣe faili Gerber fun wọn.
| Nkan | Apejuwe | Awọn agbara imọ-ẹrọ |
| 1 | Fẹlẹfẹlẹ | 1-20 fẹlẹfẹlẹ |
| 2 | Iwọn igbimọ ti o pọju | 1200x600mm (47x23") |
| 3 | Awọn ohun elo | FR-4, TG FR4 giga, ohun elo halogen ọfẹ, Rogers, Arlon, PTFE, Taconic, ISOLA, awọn ohun elo amọ, aluminiomu, ipilẹ bàbà |
| 4 | Max sisanra ọkọ | 330 mil (8.4mm) |
| 5 | Min akojọpọ ila iwọn / aaye | 3mil (0.075mm)/3mil (0.075mm) |
| 6 | Min lode ila iwọn / aaye | 3 mil (0.75mm) / 3 mil (0.075mm) |
| 7 | Min pari Iho iwọn | 4 mil (0.10mm) |
| 8 | Min nipasẹ iho iwọn ati ki o paadi | Nipasẹ: opin 0.2mm Paadi: opin 0.4mm HDI <0.10mm nipasẹ |
| 9 | Min iho ifarada | ± 0.05mm (NPTH), ± 0.076mm (PTH) |
| 10 | Ifarada iwọn iho ti o pari (PTH) | ± 2 mil (0.05mm) |
| 11 | Ifarada iwọn iho ti o pari (NPTH) | ± 1 mil (0.025mm) |
| 12 | Iho ipo iyapa ifarada | ± 2 mil (0.05mm) |
| 13 | Min S/M ipolowo | 3 mil (0.075mm) |
| 14 | Solder boju lile | ≥6H |
| 15 | Flammability | 94V-0 |
| 16 | Ipari dada | OSP, ENIG, goolu filasi, tin immersion, HASL, tin-palara, fadaka immersion,inki erogba, boju-boju-pipa, awọn ika ọwọ goolu (30μ”), fadaka immersion (3-10u”), tin immersion (0.6-1.2um) |
| 17 | V-ge igun | 30/45/60 °, ifarada ± 5 ° |
| 18 | Min V-ge sisanra ọkọ | 0.75mm |
| 19 | Min afọju / sin nipasẹ | 0.15mm (6mil) |
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