Awọn iṣẹ iṣelọpọ Itanna-iduro kan, ṣe iranlọwọ fun ọ ni irọrun ṣaṣeyọri awọn ọja itanna rẹ lati PCB & PCBA

PCB ENIG ti o ga julọ fun ohun elo iṣoogun Aerospace agbegbe aabo ologun sisanra goolu 1u”-3u”

Apejuwe kukuru:

A n ṣe pcb ati apejọ pcb awọn ile-iṣẹ iṣẹ iduro kan. ni 400 eniyan lapapọ. 20% mu iwọn tita ọja pọ si ni ọdun kọọkan. 70% iṣelọpọ gbogbo lati okeokun. a ṣe 1-12layer.FR4.CEM-1.CEM-3.HDI. AL ohun elo.


Alaye ọja

ọja Tags

Awọn pato bọtini / Awọn ẹya pataki

A n ṣe pcb ati apejọ pcb awọn ile-iṣẹ iṣẹ iduro kan. ni 400 eniyan lapapọ. 20% mu iwọn tita ọja pọ si ni ọdun kọọkan. 70% iṣelọpọ gbogbo lati okeokun. a ṣe 1-12layer.FR4.CEM-1.CEM-3.HDI. AL ohun elo. ti a ba wa kaabo prototypes bibere. Awọn ayẹwo pcb deede nipa awọn ọjọ 3 le firanṣẹ a le firanṣẹ si laarin wakati 12 tabi awọn idiyele isanwo wakati 24. pcba prototypes nipa 1day le ifijiṣẹ. smt ati dip ati nipasẹ awọn paati ọwọ gbogbo le ṣe. pẹlu 0201 irinše.BGA. 100% Didara ileri. nitori Fly ibere. E-igbeyewo selifu.X-RAY.AOI. Idanwo iṣẹ fun kọọkan ọkọ. a le ṣe apẹrẹ apẹrẹ tabi daakọ igbimọ ti ko ba si faili pcb gerber ati akojọ bom. o le firanṣẹ awọn iṣaju rẹ apẹẹrẹ otitọ si wa ti o ba ni. jọwọ pese shematic aworan atọka. iwọn ìla. awọn ẹya datasheet ti ko ba si awọn ayẹwo otitọ. a ni idaniloju atunṣe tabi tun ṣe tabi jẹri awọn idiyele awọn iṣoro didara ti didara ba ṣe awọn ẹgbẹ wa. eyikeyi idahun yoo wa ni esi laarin 5hour. a ni ISO9001.TS16949.SGS.UL. Ijẹrisi ROHS. Nwa siwaju lati gbọ lati rẹ laipe. kaabo rẹ ìfilọ laipe.

Imọ paramita
Ohun elo: FR-4, CEM-3, CEM-1, AL, HDI, Halogen-ọfẹ, Awọn igbimọ seramiki
• Min Solder Boju Afara: 0.1mm
• Min/max Solder Boju sisanra:10um-25um
• Min diduro iwọn ila opin tita:0.1mm(ẹgbẹ ẹyọkan)
• Ifarada Iwọn: PTH ± 0.076mm NPTH ± 0.05mm
•Tenting nipasẹ Boju-boju (bẹẹni/bẹẹẹkọ): Bẹẹni
• Awọn iṣiro Layer: 1-12 LAYER
• Sisanra Board:0.4mm—3.5mm
• Ifarada Ọra (t≥0.8mm): 0.8 +/- 0.1mm; 1.2-1.6 +/-0.13mm; 2.4 +/- 0.18mm; 3.2 +/- 0.25mm
• Ifarada Sisanra ( T <0.8mm): 0.4-0.6 +/- 0.1mm
Laini to kere julọ (0,5OZ):0.10mm(fun goolu didin):Alafo to kere julọ (0,5OZ)0.10mm(fun didan goolu)
• Laini Kere (1OZ): 0.15mm: Laini Kere (2OZ): 0.20mm
• Laini Kere (3OZ): 0.25mm: Alafo Kere (1OZ): 0.15mm
• Alafo Kere (2OZ): 0.20mm
• Alafo Kere (3OZ): 0.25mm
• Jade Layer Ejò Sisanra: 0.5-2OZ
• Inu Layer Ejò Sisanra: 0.5-2OZ
• Min liluho Iho (Ti pari): 0.25mm
• Oruka annular: 0.1mm Iforukọ: ± 0.1mm
• Ratio aspect: Nipasẹ Iho - 8: 1
• Solder Awọ Boju: Alawọ ewe, dudu, pupa, funfun. Mini. Solder boju Kiliaransi:0.05mm
• Awọ arosọ: Alawọ ewe, funfun, pupa, ofeefee, dudu.
• Iwọn Igbimọ ti o pọju: 500x600mm
• Yiyi ati Teriba (fun apejọ SMT): ≤0.75%
Sisanra Tin/Asiwaju HASL: 5-25um

Eto iṣakoso ẹrọ ibaraẹnisọrọ satẹlaiti

Ohun elo: FR-41.6T1 / 1/1/1 OZ
Iwọn ila to kere julọ /
Ijinna laini: 6/6 mil
Iwo ti o kere julọ: 0.3mm
dada ti pari: dudu masking epo nickel goolu 6Layers
Ohun elo: Home ohun elo Iṣakoso modaboudu

Ohun elo: FR-41.6T1 / 1/1 OZ

Iwọn ila to kere julọ / Ijinna laini: 4/4mi1
Iho to kere julọ /
BGA ti o kere julọ: 0.25mm / 0.25 * 0.25mm
dada ti pari: bulu masking epo nickel goolu 6Layers
Lilo ọja: igbimọ lilọ kiri iRobot

PCBA olupese ni China

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