Awọn iṣẹ iṣelọpọ Itanna-iduro kan, ṣe iranlọwọ fun ọ ni irọrun ṣaṣeyọri awọn ọja itanna rẹ lati PCB & PCBA

Famuwia Iyipada PCB Daakọ PCB oniye PCB sọfitiwia ṣe idagbasoke PCBA Iyipada Iṣẹ Imọ-ẹrọ

Apejuwe kukuru:

Ohun elo:

Aerospace, BMS, Ibaraẹnisọrọ, Kọmputa, Itanna Olumulo, Ohun elo ile, LED, Awọn ohun elo iṣoogun, Modaboudu, Smart Electronics, Gbigba agbara Alailowaya

Awọn ohun elo idabobo:

Resini Epoxy, Awọn ohun elo Apapo Irin, Resini Organic

Ohun elo:

Aluminiomu Bo Ejò Fáìlì Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resini & Polyimide Resini, Paper Phenolic Copper Foil Substrate, Sintetiki Fiber

Imọ ọna ṣiṣe:

Idaduro Ipa Fọọmu, Itanna Electrolytic


Alaye ọja

ọja Tags

Awọn pato bọtini / Awọn ẹya pataki

Wa Akọkọ Service

PCB & PCBA Apẹrẹ

Awọn nkan elo orisun

IC siseto

PCB iṣelọpọ

SMT Ilé

Iṣelọpọ DIP

Igbeyewo Iṣẹ-ṣiṣe PCBA

Aso ibamu

Tẹ Fit

Ilana COB

Laser Engraving

Apoti Ilé

Nkan

Paramter

Irú igbimọ:

PCB kosemi, PCB rọ, PCB mojuto irin, Rigid-Flex PCB

Apẹrẹ igbimọ:

Onigun onigun, Ipin ati eyikeyi Awọn apẹrẹ Odd

Iwọn:

50 * 50mm ~ 400mm * 1200mm

Package Min:

01005 (0.4mm * 0.2mm),0201

Awọn ẹya Pitch Ti o dara:

0.25mm

Package BGA:

Dia. 0.14mm, BGA 0.2mm ipolowo

Yiye iṣagbesori:

± 0.035mm(± 0.025mm) Cpk≥1.0 (3σ)

Agbara SMT:

3 Milionu ~ 4 Milionu Soldering Pad / ọjọ

Agbara DIP:

100 ẹgbẹrun pinni / ọjọ

Agbara Apejọ

100 ẹgbẹrun pinni / ọjọ

Ipese Awọn ẹya:

Gbogbo awọn paati ti o wa nipasẹ Cmy, Alagbase Apa kan, Kitted/Ti fi silẹ

Package Awọn ẹya:

Reels, Ge teepu, Tube & Atẹ, Loose Parts and Bulk

Idanwo:

Ayẹwo wiwo; AOI ; X-RAY; Idanwo iṣẹ-ṣiṣe, ICT

Awọn oriṣi ti Solder:

asiwaju-free (RoHS ifaramọ) ijọ awọn iṣẹ

Aṣayan Apejọ:

Lati SMT si Assy, ibora ibamu, Tẹ ibamu

Stencis:

Lesa ge alagbara, irin stencil, Nano stencil, FG stencil

Awọn ọna kika faili:

Iwe-owo Awọn ohun elo, PCB (Awọn faili Gerber)

Iwọn Didara:

IPC-A-610, IPC-A-600


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