Awọn iṣẹ iṣelọpọ Itanna-iduro kan, ṣe iranlọwọ fun ọ ni irọrun ṣaṣeyọri awọn ọja itanna rẹ lati PCB & PCBA

Fire itaniji Circuit ọkọ eto ọkọ mora miiran pcb & pcba

Apejuwe kukuru:

Ẹya ara ẹrọ:Aṣa atilẹyin

Layer:Layer-Double, Multilayer, Single-Layer

Aso Irin:Silver, Tin

Ipo iṣelọpọ: SMT

Iru:BMS PCBA, PCBA Ibaraẹnisọrọ, PCBA Electronics, PCBA ohun elo ile, PCBA LED, PCBA modaboudu, Smart Electronics PCBA, Alailowaya gbigba agbara PCBA


Alaye ọja

ọja Tags

Awọn pato bọtini / Awọn ẹya pataki

Inki erogba ti wa ni titẹ lori PCB dada bi oludari lati so awọn itọpa meji pọ lori PCB. Fun inki erogba PCB, pataki julọ ni didara ati resistance ti epo erogba, nibayi, Immersion fadaka PCB ati Immersion tin PCB ko le ṣe titẹ epo erogba, nitori wọn jẹ Oxidizing.Nibasibẹ, aaye laini to kere julọ yẹ ki o jẹ diẹ sii ju 0.2 mm ki o rọrun lati ṣelọpọ ati iṣakoso laisi Circuit kukuru.

Erogba inki le ṣee lo fun awọn olubasọrọ keyboard, LCD awọn olubasọrọ ati awọn jumpers. Titẹ sita ti wa ni ošišẹ ti pẹlu conductive erogba inki.

  • Erogba eroja gbọdọ koju soldering tabi HAL.
  • Awọn idabobo tabi awọn iwọn Erogba le ma dinku ni isalẹ 75 % ti iye ipin.
  • Nigba miiran iboju-boju ti o le peeli jẹ pataki lati daabobo lodi si awọn ṣiṣan ti a lo.

Pataki Erogba Epo ilana

  1. Oniṣẹ gbọdọ wọ awọn ibọwọ
    2.Awọn ohun elo gbọdọ jẹ mimọ, oju ko ni ni eruku, idoti ati awọn idoti miiran
    3.Silk iyara ati ki o pada si awọn inki iyara afamora titẹ agbara ni ibiti o dara ju. (Da lori ipa titẹ bi idanwo)
    4.Screen stencil, scraper, erogba epo pato awọn ibeere ni ibamu pẹlu awọn ibeere ti imọ-ẹrọ MI
    5.Epo erogba gbọdọ jẹ dapọ ni deede ṣaaju lilo, pẹlu viscometer lati ṣe awari iki laarin ibiti o nilo, inki nilo pipade akoko lẹhin ipari lilo.
    6.Before titẹ sita, gbogbo awọn lọọgan gbọdọ wa ni ti mọtoto awo girisi, oxide ati awọn miiran pollutants, gbogbo erogba awo erogba awo gbọdọ wa ni timo nipa awọn QA ṣaaju ki o to awọn osise gbóògì
    7.Carbon ọkọ gbigbe otutu 150 ℃ akoko 45 iṣẹju. Iho erogba epo otutu otutu 150 ℃ Aago 20 iṣẹju
    8.Carbon epo resistance wiwọn, resistance iye ti erogba epo yẹ ki o wa kere ju 100 ohms, erogba ila resistance yẹ ki o wa kere ju 25Ω
    9.After itusilẹ lati inu adiro, oniṣẹ yẹ ki o sọ fun QA lati ṣayẹwo idiwọ erogba ati ṣe idanwo adhesion.
    10.Each erogba epo iboju version lo max 2500 tẹ jade, gbọdọ wa ni pada si awọn nẹtiwọki yara tun-gbigbe awọn titun ti ikede nigbati soke si 2500 igba.

A gbagbọ pe PCBA epo Erogba nfunni ni akojọpọ didara, iṣẹ ṣiṣe, ati iye ti a ko le bori. Ti o ba ni ibeere eyikeyi nipa ọja yii tabi yoo fẹ lati ni imọ siwaju sii nipa bi o ṣe le ṣe anfani iṣowo rẹ, jọwọ ma ṣe ṣiyemeji lati kan si wa. A ṣe iyasọtọ lati pese iṣẹ alabara ti o dara julọ ati iranlọwọ awọn alabara wa lati ṣaṣeyọri awọn ibi-afẹde iṣowo wọn.

O ṣeun fun ero erogba epo PCBA. A nireti aye lati ṣiṣẹ pẹlu rẹ ati ṣe iranlọwọ fun ọ lati ṣaṣeyọri aṣeyọri.

Ọja paramita

Nkan Sipesifikesonu
Ohun elo FR-4, FR1,FR2; CEM-1, CEM-3, Rogers, Teflon, Arlon, Aluminiomu Base, Ejò Base, Seramiki, Crockery, ati be be lo.
Awọn akiyesi Tg CCL giga wa (Tg>=170℃)
Pari Board Sisanra 0.2 mm-6.00mm(8mil-126mil)
Dada Ipari Ika goolu (> = 0.13um), Gold Immersion (0.025-0075um), Gold Plating (0.025-3.0um), HASL (5-20um), OSP (0.2-0.5um)
Apẹrẹ Ipa ọna,Punch,V-gige,Chamfer
dada Itoju Boju-boju (dudu, alawọ ewe, funfun, pupa, bulu, sisanra>=12um, Àkọsílẹ, BGA)
  Iboju silk (dudu, ofeefee, funfun)
  Peeli-boju-boju (pupa, bulu, sisanra>=300um)
Koju ti o kere julọ 0.075mm(3mili)
Sisanra Ejò 1/2 iwon min; 12oz ti o pọju
Min Wa kakiri Iwọn & Laini Aye 0.075mm/0.075mm(3mili/3mili)
Min Iho opin fun CNC liluho 0.1mm(4mil)
Min Iho opin fun Punching 0.6mm(35mil)
Iwọn nronu ti o tobi julọ 610mm * 508mm
Iho Ipo +/- 0.075mm (3mil) CNC Liluho
Ìbú Adarí (W) +/- 0.05mm (2mil) tabi +/- 20% ti atilẹba
Opin Iho (H) PTHL:+/- 0.075mm(3mil)
  Kii PTHL:+/- 0.05mm(2mil)
Ifarada Ifarada +/- 0.1mm (4mil) CNC afisona
Warp & Twist 0.70%
Idabobo Resistance 10Kohm-20Mohm
Iwa ihuwasi <50ohm
Igbeyewo Foliteji 10-300V
Iwọn igbimọ 110 x 100mm(iṣẹju)
  660 x 600mm(o pọju)
Aṣiṣe iforukọsilẹ Layer-Layer 4 fẹlẹfẹlẹ: 0.15mm (6mil) max
  6 fẹlẹfẹlẹ: 0.25mm (10mil) max
Aaye min laarin eti iho si ilana iyika ti Layer akojọpọ 0.25mm(10mil)
Aaye min laarin ilana igbimọ si ilana iyika ti Layer akojọpọ 0.25mm(10mil)
Board sisanra ifarada 4 fẹlẹfẹlẹ:+/- 0.13mm(5mil)

Awọn Anfani Wa

1) Awọn agbara R&D olominira - Ẹgbẹ wa ti sọfitiwia ti o ni iriri ati awọn onimọ-ẹrọ ohun elo le ṣe apẹrẹ ati dagbasoke awọn igbimọ itanna aṣa lati baamu awọn iwulo pato rẹ.
2) Iṣẹ-iduro kan - 8 wa ti o ga julọ ati awọn laini iṣelọpọ ẹrọ gbigbe 12, bakanna bi awọn laini iṣelọpọ plug-in 4 ati awọn paipu 3, pese laisiyonu, ilana iṣelọpọ okeerẹ fun gbogbo awọn alabara wa.

3) Idahun iyara - A ṣe pataki itẹlọrun alabara ati ifọkansi lati pese iṣẹ iyara, iṣẹ ṣiṣe lati pade gbogbo awọn iwulo rẹ.


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